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    EN/CN

    Product

    SG7350D

    Characteristic


    ●Glass-reinforced PTFE and ceramic dielectric.

    ●Excellent high frequencyperformance.

    ●Enhanced thermalconductivity.

    ●Stable electricalproperties versus frequency.

    ●Low Z-axis expansion andexcellent dimensional stability.

    ●Compatible with lead-freeprocess.

    Application Area

    Passive Components；

    Power Amplifiers；

    Microwave Combiner and Power Dividers；

    LNA/LNB；




    • Product Performance
    • Product Certificate
    • Data Download
    Items Method Condition Unit Typical Value
    Process Dk IPC-TM-650 2.5.5.5 [1] 10GHz/23℃ - 3.55
    Process Df IPC-TM-650 2.5.5.5 [1] 10GHz/23℃ - 0.0022
    TcDk IPC-TM-650 2.5.5.5 -25°C to 125°C ppm/°C -14
    Volume Resistivity IPC-TM-650 2.5.17.1 A MΩ·cm 5.8 x 106
    Surface Resistivity
    		 IPC-TM-650 2.5.17.1
    		 A MΩ 2.9 x 107
    Td ASTM D3850 TGA (5% W.L) ℃ 565
    CTE (X/Y/Z-axis) IPC-TM-650 2.4.24 TMA (30-260℃) ppm/℃ 9/8/25
    Peel Strength
    		 IPC-TM-650 2.4.8

    after solder float

    1oz. ED Foil     		N/mm [ln/in] 0.90 [5.14]
    Water Absorption IPC-TM-650 2.6.2.1 D-24/34 % 0.05
    Thermal Conductivity ASTM D5470 100℃ W/m·K 0.80
    Flexural Strength (X/Y-axis) IPC-TM-650 2.4.4 A MPa 100/80
    Flammability
    		 UL-94 C-48/23/50 Rating V-0

    Remarks:

    (1) All the typical valueis based on the 0.508mm(0.020”) specimen, and the specification sheet is basedon IPC4103.

    (2) Typical values are a representation of anaverage value for the population of the property.